A review on modelling and numerical simulation of micro hot embossing process: fabrication, mold filling behavior, and demolding analysis

Abstract Micro-hot embossing (micro-HE) of polymeric materials creates exact micro/nanoscale designs. Micro-HE processes include plate-to-plate (P2P), roll-to-roll (R2R), and roll-to-plate (R2P). is preferred for large-scale production micro-patterns on polymer substrates. However, the lack simulation models optimization component design prevents broad use this technology. As size micro patterns decreases from micron to sub-micron, it improves performance features. cannot be analyzed using software tools like injection molding since there no macroscopic equivalent. Commercial covers associated processes. No commercial tool all micro-HE process steps, variations, boundary conditions. According author, such review articles are not in literature. This article summarizes work field related replication accuracy, mold filling behaviour. In addition various were discussed based properties material, forces participate HE process, gives a detailed idea about mold-filling behavior demolding analysis. Finally, challenges future scope modelling hot has been presented.